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publicationDate 2017-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017171898-A
titleOfInvention Insulating resin material, insulating resin material with metal layer and wiring board using the same
abstract An insulating resin material which is a material having both a low dielectric constant and a low thermal linear expansion coefficient, which are difficult to obtain in the past, and an insulating resin material with a metal layer and a wiring board using the insulating resin material. An insulating resin material containing an inorganic porous aggregate 2 having pores 3 composed of a plurality of fine particles and a fibril 4 made of polytetrafluoroethylene, wherein the fibril 4 is multidirectional. An insulating resin material that is oriented and has a fine network structure in which at least one of the inorganic porous aggregate 2 and the fibril 4 is connected to each other and the porosity is 50% or more. [Selection] Figure 1
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