Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0175 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L27-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
filingDate |
2017-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2537a425aaa7488c35f27c69fcc122c4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c119d7a61075ebc01602382c69f1a68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50aebe8bb68da8f858ddb17421506f90 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c0d85ab6a9ae3113502c7136ceb6e2c |
publicationDate |
2017-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2017171898-A |
titleOfInvention |
Insulating resin material, insulating resin material with metal layer and wiring board using the same |
abstract |
An insulating resin material which is a material having both a low dielectric constant and a low thermal linear expansion coefficient, which are difficult to obtain in the past, and an insulating resin material with a metal layer and a wiring board using the insulating resin material. An insulating resin material containing an inorganic porous aggregate 2 having pores 3 composed of a plurality of fine particles and a fibril 4 made of polytetrafluoroethylene, wherein the fibril 4 is multidirectional. An insulating resin material that is oriented and has a fine network structure in which at least one of the inorganic porous aggregate 2 and the fibril 4 is connected to each other and the porosity is 50% or more. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019183005-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7151140-B2 |
priorityDate |
2016-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |