http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017170480-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bd0cdbc5c67cf4957ed83c89140748e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C12-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-40 |
| filingDate | 2016-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c2d6bd93509fba5aa826a5ea54853d9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fe3401bd2c78f25527686f1315d985e |
| publicationDate | 2017-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2017170480-A |
| titleOfInvention | Pb-free solder paste for high temperature and its manufacturing method |
| abstract | PROBLEM TO BE SOLVED: To provide a Pb-free solder paste mainly composed of Bi for high temperature and having excellent wettability, bondability, bond reliability, etc. and a method for producing the same. A solder paste comprising a solder alloy powder having a uniform thickness coating with an organic acid on the surface and a flux, wherein the flux is 5.0% by mass with respect to a total of 100% by mass of the solder paste. The content is 20.0% by mass or less, and the solder alloy powder is composed of Bi-based solder alloy powder. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7189480-B1 |
| priorityDate | 2016-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.