http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017157779-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
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filingDate 2016-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6422cfb38175b1fba36fbd81e06ba94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_575a046b0040061724c347636c4df84e
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publicationDate 2017-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017157779-A
titleOfInvention Semiconductor device manufacturing method and semiconductor device
abstract A method of manufacturing a semiconductor device and a semiconductor device capable of achieving desired electrical characteristics are provided. A manufacturing method of a semiconductor device includes a semiconductor substrate made of a germanium-based material, and an N-type SD region (source / drain region) is formed on a part of the semiconductor substrate. It is a manufacturing method. The manufacturing method of the semiconductor device 1 includes a step of implanting N-type impurities into a part of the semiconductor substrate 11 and a step of implanting ions of a co-implanted element. [Selection] Figure 2
priorityDate 2016-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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