| abstract |
The present invention provides a flexible copper foil laminate excellent in dimensional stability, bending resistance and post-oil resistance, a flexible printed circuit board including the same, and a method for manufacturing the same. A flexible copper foil laminate according to an embodiment of the present invention includes a first copper foil layer, a composite polyimide layer, and a second copper foil layer sequentially laminated. The composite polyimide layer includes a polyimide layer and a plurality of thermoplastic layers. A polyimide layer is included, and the outermost layer of the composite polyimide layer is a thermoplastic polyimide layer. The total thickness of the plurality of thermoplastic polyimide layers may be 15 to 50%, and the thickness of the polyimide layer may be 50 to 85% with respect to the total thickness of the composite polyimide layer. The thicknesses of the first copper foil layer and the second copper foil layer are 30 to 80 μm, respectively, and the total thickness of the composite polyimide layer is 40 to 60 μm. [Selection] Figure 1 |