http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017148862-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bd0cdbc5c67cf4957ed83c89140748e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C12-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 |
| filingDate | 2016-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_295ae3f212be3fdace983f1a5b385d14 |
| publicationDate | 2017-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2017148862-A |
| titleOfInvention | Solder paste |
| abstract | An object of the present invention is to provide a solder paste capable of forming a solder joint portion having sufficient joint strength even when used for joining a member to be joined containing Cu on the joint surface. A solder paste containing metal powder, comprising: The metal powder is composed of an alloy powder containing Bi and Ag, and Sn powder, The alloy powder containing Bi and Ag contains Ag in a proportion of 0.1% by mass or more and 11.0% by mass or less, and the proportion of the Sn powder in the metal powder is 0.2% by mass or more. Provided is a solder paste of 3.0% by mass or less. [Selection] Figure 1 |
| priorityDate | 2016-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.