| abstract |
The present invention provides an oxazine resin composition that provides a cured product having good heat resistance and dimensional stability even when cured at a low temperature for a short time, and a cured product thereof. SOLUTION: An oxazine resin (A) and an epoxy resin (B) are included, the oxazine resin (A) is represented by the formula (1), the content of n = 0 isomer is 15% or less, n = 1 isomer and n = Oxazine resin composition having a total content of 2 bodies of 35 to 70%, a content of n = 3 bodies or more of 50% or less, and a number average molecular weight of 400 to 2500. (A 1 is an aromatic ring group selected from a benzene ring, a naphthalene ring or a biphenyl ring, X is a divalent bridging group, m is 1 or 2, and n is 1 to 5.) [Selection] Figure 1 |