Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9411b8457b2593647e3dec40cca58d59 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
filingDate |
2016-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13961a7072e1bc46e199a3472d473123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43d6e55963e7c753b0333029b9429e77 |
publicationDate |
2017-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2017135150-A |
titleOfInvention |
Heat dissipation member and semiconductor module |
abstract |
To provide a heat dissipating member having excellent heat conductivity, and to provide a semiconductor module having good heat dissipating property. An inorganic material having a first surface and a second surface opposite to the first surface, which is continuous from the first surface side to the second surface side and has excellent thermal conductivity is included. Provided is a heat dissipation member. [Selection] Figure 6 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022081849-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7167310-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020194868-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020194868-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7072624-B1 |
priorityDate |
2016-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |