http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017128619-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
filingDate 2016-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94de8891ca4ee6b453c39930cbc4d1a9
publicationDate 2017-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017128619-A
titleOfInvention Adhesive tape for electronic parts
abstract The present invention provides an electronic component pressure-sensitive adhesive tape capable of satisfactorily peeling an electronic component after transportation even when it is exposed to a hot and humid environment for several weeks for a long time during transportation. With the goal. The pressure-sensitive adhesive tape for electronic parts according to the present invention is a pressure-sensitive adhesive tape for electronic parts in which a pressure-sensitive adhesive layer is formed on at least one side of a base film, and is bonded to a silicon mirror surface at 23 ° C. and 50%. After being left in an RH environment for 1 hour, the adhesive force to the silicon mirror surface measured at 23 ° C. and 50% RH at a peeling angle of 90 degrees and a peeling speed of 50 mm / min is defined as P1, and this is applied to the silicon mirror surface. Then, after being left for 1 week in an environment of 60 ° C. and 50% RH, the adhesive strength to the silicon mirror surface measured at a peeling angle of 90 degrees and a peeling speed of 50 mm / min under the conditions of 23 ° C. and 50% RH. When P2, it is characterized by 0N / 25mm ≦ P2-P1 ≦ 0.7N / 25mm. [Selection] Figure 1
priorityDate 2016-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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