| abstract |
An object of the present invention is to provide a cover lay film which has good workability and workability despite being a thin film and has excellent followability to a flexible printed circuit board (FPC). In order to solve the above problems, a base material 12 made of a coated thin film resin layer and a thermosetting adhesive layer 13 are sequentially laminated on one surface of a support film 11. Provided is a coverlay film 10 in which the tensile elongation of the substrate 12 according to the method of JIS-K-7127 is 100% or more. [Selection] Figure 1 |