| abstract |
An epoxy resin composition exhibiting a desired fluid curing behavior at an appropriate mold temperature from 100 ° C. to 140 ° C. in order to obtain a high-quality composite. (A) at least one epoxy compound, (B1) 20% to 40% by weight of at least one diamine and / or polyamine based on triacetonediamine, and (B2) at least one further A curing agent composition comprising 60% by mass to 80% by mass of a diamine and / or a polyamine, wherein the stoichiometric ratio between the epoxy group of A) and the number of active hydrogen atoms of the functional group of (B1 + B2) is 1 0.5) to 1: 1, and further comprising C) at least one curing accelerator, (D) optionally at least one latent curing agent, and (E) optionally further additives. Epoxy resin composition. [Selection figure] None |