http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017120866-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2015-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5e810d9f13dfc6756ddc2e1396a2324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_312eb1534f10a31e80f58bbbc24fc24f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ad1be2e47eca26c27ba744637e150e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d7e8b2f9317e5ebb39e88207e6f8925 |
| publicationDate | 2017-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2017120866-A |
| titleOfInvention | Method of forming solder bump |
| abstract | A solder bump forming method capable of forming a fine solder bump while suppressing a missing bump. A method for forming solder bumps according to the present invention is a method for forming solder bumps on a plurality of electrode pads 12 formed on the surface of a wiring board 1, wherein a photosensitive resin composition is formed on the wiring board 1. Is applied to form a coating film having a haze value at 385 nm of 65% or more, and the coating film is exposed and developed to provide an opening corresponding to the electrode pad 12, and an end of the opening. A temporary resist film forming step of forming a temporary resist film 2 having a tapered cross-sectional shape and a taper angle θ of 75 ° or less in the cross-sectional shape; and filling the opening with a solder paste and reflowing A method comprising: a solder bump forming step of performing a process to form a solder bump; and a temporary resist film peeling step of peeling the temporary resist film 2 from the wiring substrate 1 It is. [Selection] Figure 4 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7107667-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109378271-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019096826-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7346137-B2 |
| priorityDate | 2015-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 95.