| abstract |
The present invention provides an effective method capable of producing a device having improved adhesion and mechanical structural stability without sacrificing the conductivity of metal nanoparticle ink. An interlayer composition comprising an epoxy resin, polyvinylphenol, a poly (melamine-co-formaldehyde) polymer, a solvent, an optional surfactant, and an optional catalyst. And an interlayer layer disposed on the substrate, having electrical conductivity, the interlayer layer comprising an epoxy resin, polyvinylphenol, a poly (melamine-co-formaldehyde) polymer, an optional surfactant, A device made from a composition comprising an optional catalyst. Conductive on the substrate, including depositing an interlayer on the substrate, curing the interlayer by heat, and depositing and annealing the conductive composition on the interlayer. Process for creating. [Selection figure] None |