| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_beaff8169965bd7b4d7b6e35d6701a9d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14685
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14643
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1462 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8234
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04 |
| filingDate |
2016-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e006229896efaf97a78d7672a767c55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0c55c89d5ec7b0026dcaa264c9b2b37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cd6d70be158d85c69968069a7278a14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a733b9877a423c6230caf6365ba23f5 |
| publicationDate |
2017-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2017108109-A |
| titleOfInvention |
Semiconductor image sensor device and method of forming a structure |
| abstract |
A structure and method of a semiconductor image sensor device that improves separation between pixels and double-sided mask alignment capability. A method of forming a backside illuminated image sensor 11 provides a region 27 of semiconductor material having a first major surface 271 and a second major surface 272 configured to receive incident light. Including doing. A pixel structure is formed in the region of semiconductor material adjacent to the first major surface. Thereafter, a trench structure 115 comprising a metal material is formed to extend through the region of semiconductor material. The first surface 1122 of the trench structure is adjacent to the first main surface of the region of semiconductor material, and the second surface 1121 is adjacent to the second main surface of the region of semiconductor material. The first contact structures 121 and 128 are electrically connected to one surface of the conductive trench structure, and the second contact structure 156 is electrically connected to the second surface on the opposite side. [Selection] Figure 17 |
| priorityDate |
2015-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |