| abstract |
An anisotropic conductive paste having sufficient adhesive strength, insulation and moisture resistance even when the temperature during thermocompression bonding is low (for example, 180 ° C. or lower). An anisotropic conductive paste of the present invention comprises (A) a thermoplastic resin, (B) a (meth) acrylate reactive diluent having one unsaturated double bond in one molecule, C) radical polymerization initiator, (D) an activator having one or more carboxyl groups in one molecule, (E) solder powder, (F) (meth) acrylic polymer fine particles having a core-shell structure, And (F) the blending amount of the (meth) acrylic polymer fine particles having a core-shell structure is 22 parts by mass or more and 70 parts by mass or less with respect to 100 parts by mass of the (A) thermoplastic resin. It is characterized by. [Selection figure] None |