| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e643df164d408263905077a4d3016558 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03G15-0216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03G15-0233 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F16C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03G15-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03G15-00 |
| filingDate |
2016-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fdcbb7caed566069c5f04e84f8d6d6a |
| publicationDate |
2017-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2017107147-A |
| titleOfInvention |
Semiconductive roller and method for manufacturing the same |
| abstract |
Semi-conductivity that can better suppress the occurrence and problems of adhesion and accumulation of external additives and the like when used as, for example, a charging roller without forming a coating film having various problems And a method of manufacturing such a semiconductive roller. A semiconductive roller has a plurality of recesses 2 formed on its outer peripheral surface 1 so as to overlap each other in at least a part of at least one of a circumferential direction and an axial direction of the outer peripheral surface. A manufacturing method includes the process of forming the said recessed part by laser processing. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019207283-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10585372-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110543085-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10712685-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111381475-A |
| priorityDate |
2015-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |