http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017106093-A

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filingDate 2016-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d499a143e4a7efcb49c4798303c85fc9
publicationDate 2017-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017106093-A
titleOfInvention Method for producing copper three-dimensional nanostructure
abstract In a method of forming a copper three-dimensional nanostructure having a form in which thin plate-like precipitates made of copper are randomly mixed on a substrate by an electrolytic copper plating method, the structure of the copper three-dimensional nanostructure is formed. Provided is a method for producing a copper three-dimensional nanostructure that can increase the mechanical strength of the copper three-dimensional nanostructure while maintaining and increasing the connection strength with the substrate. A step of forming a copper three-dimensional nanostructure on a substrate; and a step of applying a reinforcing plating to the substrate on which the copper three-dimensional nanostructure is formed. Copper is plated using a plating bath to which an additive (PEG + SPS) for selectively depositing copper is selectively deposited on the base side rather than the tip side of the copper three-dimensional nanostructure formed on the substrate. A method for producing a three-dimensional nanostructure. [Selection] Figure 5
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