| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 |
| filingDate |
2015-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17e84c9c6148996c0dc4a163da2c5a69
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98e10d773ad3ad663432cb56d7fe8672 |
| publicationDate |
2017-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2017106069-A |
| titleOfInvention |
Surface-treated copper foil for printed wiring board, copper-clad laminate for printed wiring board, and printed wiring board |
| abstract |
To obtain a printed wiring board having a high transmission loss even when transmitting a high frequency signal in the GHz band, having high adhesion to a resin base material, excellent durability, and excellent visibility. Provided is a surface-treated copper foil for a printed wiring board. A surface-treated copper foil for a printed wiring board having a silane coupling agent layer on the surface on which roughened particles are formed, wherein the average height of the roughened particles is 0 on the surface of the silane coupling agent layer. Surface treated copper for printed wiring boards having a BET surface area ratio of 1.2 or more and a fine surface coefficient Cms of 2.0 or more and less than 8.0 on the surface of the silane coupling agent layer. Foil. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7251928-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019210521-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019060677-A |
| priorityDate |
2015-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |