| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf334efdc57a817d413aef1d9f5e9d80 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54453
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D1-221
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67712
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-268 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-57
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38 |
| filingDate |
2015-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45adb7350588ea4272763d119117228f |
| publicationDate |
2017-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2017103405-A |
| titleOfInvention |
Wafer processing method |
| abstract |
An object of the present invention is to provide a wafer processing method capable of thinning individually separated devices even when a substrate having high hardness is adopted as a wafer on which functional layers are laminated. is there. A method of processing a wafer according to the present invention includes a method in which a functional layer is stacked on a top surface of a substrate via a buffer layer and a device having a device partitioned by a predetermined division line on the surface of each wafer along the predetermined division line. A method of processing a wafer to be divided into devices, a cutting step of cutting at least a functional layer along a planned division line, a protective member disposing step of disposing a protective member on the surface of the wafer, and transmission to the substrate At least a buffer layer breaking step of irradiating the laser beam with a converging point of a laser beam having a property positioned on the buffer layer and breaking the buffer layer, and a substrate peeling step of peeling the substrate from the functional layer and separating each substrate. Composed. [Selection] Figure 4 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020078808-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7195700-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7258414-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I803712-B |
| priorityDate |
2015-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |