http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017103337-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
filingDate 2015-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8443b6b5a180916d9653fad359c3cdc8
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publicationDate 2017-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017103337-A
titleOfInvention LED element mounting substrate and manufacturing method thereof, and LED light emitting device and manufacturing method thereof
abstract An LED element mounting substrate, a method for manufacturing the same, and an LED light emitting device capable of ensuring a wide area of a reflective metal layer that reflects light from the LED element and improving the reflection efficiency of the light from the LED element And a method for manufacturing the same. An LED element mounting substrate 10 includes an insulating layer 11, a plurality of first conductive layers 12 formed on the surface of the insulating layer 11 and spaced apart from each other via a space S, and each first element. And a reflective metal layer 14 covering the surface of the conductive layer 12. Through holes 11 a are formed in the insulating layer 11 at positions corresponding to the first conductive layers 12. At least a part of each through hole 11 a is filled with an interlayer connection portion 17, and each interlayer connection portion 17 is covered with a reflective metal layer 14. [Selection] Figure 2
priorityDate 2015-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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