| abstract |
An electrical / electronic component that provides a cured product having excellent curability, high heat resistance, mechanical strength, high thermal conductivity, and thermal decomposition stability in applications such as lamination, molding, casting, and adhesion. An epoxy resin composition useful for circuit board materials such as a sealing material and a high heat dissipation sheet, and an epoxy resin used therefor are provided. An epoxy resin produced by epoxidizing a biphenol aralkyl resin obtained by reacting 4,4′-dihydroxybiphenyl with an aromatic condensing agent such as bischloromethylbiphenyl with epichlorohydrin, Mw measured in step (b) is 1,000 to 5,000 excluding n = 0 component, and n = 0 component is 15% or less of the total in area%, and this epoxy resin and curing agent An epoxy resin composition containing an inorganic filler as an essential component. [Selection figure] None |