abstract |
Disclosed is a photosensitive resin composition that has excellent sensitivity, can be cured at a low temperature of 300 ° C. or less, has excellent cured film tensile elongation, and has a cured relief pattern having a good shape. (A) A resin having a specific polyphenol structure, (B) a photoacid generator, and (C) a crosslinking agent having a phenol structure substituted with an alkoxymethyl group or a hydroxymethyl group. A photosensitive resin composition. [Selection figure] None |