http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017075406-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 |
| filingDate | 2017-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a590ab99d1c027a6941aa93eae69fa4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7172affc18f5090315af90b042a886ea http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f2ad7bdcf2388e57381d9c062c4fbbe |
| publicationDate | 2017-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2017075406-A |
| titleOfInvention | Surface treated copper foil, copper foil with carrier, substrate manufacturing method, printed wiring board manufacturing method, printed circuit board manufacturing method, copper clad laminate manufacturing method |
| abstract | Provided is a surface-treated copper foil capable of providing a profile shape of a substrate surface after removing the copper foil that maintains fine wiring formability and realizes good adhesion of an electroless copper plating film. A surface-treated copper foil used for an application in which an electroless plating film is formed on a removed portion after being bonded to a substrate on which a circuit is formed. A surface-treated copper foil having a surface roughness Sz of 1 to 5 μm on the copper foil removal side surface of the resin substrate when the surface-treated copper foil is removed by bonding to the resin substrate for a printed wiring board from the layer side. [Selection] Figure 3 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018141229-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018141228-A |
| priorityDate | 2013-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 239.