http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017074598-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5e5c121269689cbab9b3a4548b15caf3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K20-00 |
| filingDate | 2015-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7ca8ae34ba8457bf9caebde23566a47 |
| publicationDate | 2017-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2017074598-A |
| titleOfInvention | Low temperature bonding method using copper particles |
| abstract | Provided is an inexpensive and simple joining method capable of reducing residual organic components and grain boundaries in a joining layer and obtaining a joint having excellent thermal conductivity, electrical conductivity and mechanical properties. To do. A metal material joining method using copper particles, wherein the copper particles have an average particle diameter of 1 to 50 μm, and the first step of oxidizing the copper particles to obtain surface copper oxide particles is joined. And a second step of heating in a reducing atmosphere after interposing the surface copper oxide particles between the two metal members. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111375774-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110369911-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109483092-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113613811-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020196299-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111295741-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019188511-A1 |
| priorityDate | 2015-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.