| abstract |
A method of manufacturing a wiring structure capable of achieving both miniaturization of a wiring pattern and ensuring electrical connection in the wiring pattern is provided. A method for manufacturing a wiring structure is a method for manufacturing a wiring structure provided with a wiring pattern, wherein an insulating layer is provided on a surface of a silicon substrate along at least a region where the wiring pattern is to be formed. It includes a first step of forming, a second step of forming the boron layer 15 on the insulating layer 14 along the planned formation region, and a third step of forming the metal layer 16 on the boron layer 15 by plating. [Selection] Figure 2 |