http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017072756-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041 |
filingDate | 2015-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86d749c980c233dba1e9690616c79d1e |
publicationDate | 2017-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2017072756-A |
titleOfInvention | Method for forming resin cured film pattern and substrate with resin cured film pattern |
abstract | Disclosed is a method for forming a cured resin film pattern having a sufficient resolution on a substrate, and a cured resin film pattern having a thin film and a sufficient resolution. A substrate with a resin cured film pattern comprising: SOLUTION: A step of irradiating a photosensitive layer containing a photosensitive resin composition provided on a base material with an actinic ray in the presence of oxygen in a pattern, and developing the exposed photosensitive layer to develop the photosensitive layer. Forming a cured resin film pattern having a thickness smaller than that of the layer. [Selection figure] None |
priorityDate | 2015-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 115.