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filingDate 2015-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2017-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017070959-A
titleOfInvention Au-Sb-Sn solder paste
abstract PROBLEM TO BE SOLVED: To provide an inexpensive high-temperature Pb-free solder paste having a solidus temperature of about 300 ° C. or less and excellent in oxidation resistance, wettability, workability, stress relaxation property, bonding reliability, and the like. A solder paste obtained by mixing a solder alloy powder and a flux, and the solder alloy powder has a Sb content of 41.0% by mass or more and 52.0% when the total is 100% by mass. % By mass or less, preferably more than 46.7% by mass and 51.0% by mass or less, and Sn content of 2.0% by mass to 11.0% by mass, preferably more than 5.8% by mass. It is 9.0 mass% or less, and the balance is Au and inevitable impurities. [Selection figure] None
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