| abstract |
A surface-treated copper foil for a fine circuit board and a method for producing the same are provided. A method of manufacturing a surface-treated copper foil for a fine circuit board includes disposing a copper foil as a negative electrode in a plating solution containing one or more metal ions of Co, Ni, Mo, W, Cu, and Fe. A first step S100 for forming a metal alloy layer by electrolytic treatment, a second step S200 for roughening the formed metal alloy layer to form a roughened layer on which protrusions are formed, and the roughening step. A third step S300 for forming a Zn (alloy) coating layer on the layer, a fourth step S400 for forming an electrolytic chromate layer on the coating layer, and a silane coupling agent treatment layer on the electrolytic chromate layer A surface-treated copper foil for a fine circuit board, wherein the height of the projection of the roughened layer is 1 to 4 μm, and the width of the projection and the projection is 0.5 to 7 μm. And its manufacturing method. [Effect] By forming a metal alloy layer and treating the surface of the copper foil, there is an effect that the peel strength of the copper foil can be improved. [Selection] Figure 1 |