http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017066429-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-06
filingDate 2015-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd18dcefeb54b8a7871e2fa6e4a0e058
publicationDate 2017-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017066429-A
titleOfInvention Sputtering apparatus and thin film manufacturing method
abstract The present invention provides a sputtering apparatus that makes it possible to obtain a thin film having high film thickness uniformity even when film formation by sputtering is performed for a long time. A vacuum vessel, a mechanism for continuously transporting a substrate F in a roll-to-roll manner in the vacuum vessel, and a mechanism for generating plasma in a gap between a sputtering cathode 1 and an opposing surface of the substrate F And a film thickness control mask 10 disposed between the target 2 disposed on the sputtering cathode 1 and the substrate F, and a sputtering apparatus for forming a thin film by a sputtering method, A sputtering apparatus using the film thickness control mask 10 made of an iron alloy (invariant steel) containing 34 mass% to 37 mass% nickel and 0 to 10 mass% cobalt. [Selection] Figure 2
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110055505-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111334773-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020083448-A
priorityDate 2015-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 25.