| abstract |
An addition-curable curable silicone resin composition that provides a sealing material for an optical semiconductor device that does not contain bubbles and has no tackiness, a cured product thereof, and an optical semiconductor device using these. A first silicone resin obtained by hydrolytic polycondensation of an alkoxysilane compound represented by [1] to [3], having an Mw of 3,800 to 20,000, Si-H A curable silicone resin composition comprising at least a second silicone resin having a group and a hydrosilylation catalyst. [Selection] Figure 1 |