| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 |
| filingDate |
2016-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_535416e85bc91cc5e99eb56d963cc393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9eda7b9c7f9c7a962b6e9212a997200
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_065cd2e7cd8f3896d9e16b79e254dd8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eb7b51b69efa91137a1878c32ed829b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_834d804cd81e74e77d627ce8fa1965ae |
| publicationDate |
2017-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2017062453-A |
| titleOfInvention |
Photosensitive insulating film, printed circuit board, and method for producing printed circuit board |
| abstract |
A photosensitive insulating film capable of precisely forming a via hole in a printed circuit board and reducing the number of manufacturing steps and a method for manufacturing the same A photosensitive insulating film includes a photosensitive insulating resin, a filler dispersed in the photosensitive insulating resin, and a light-absorbing portion that is coated on the surface of the filler and absorbs light. the film. [Selection] Figure 1 |
| priorityDate |
2015-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |