| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5e5c121269689cbab9b3a4548b15caf3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0a521cfa321c963978df8ae98a84056a |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00 |
| filingDate |
2015-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9377407c8774037d6a0b025db883a6c9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e408cc93ea6d9be6fcb742ea9935602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52d8a96b73af23babcfec85b066b3e54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47ee04cd7cb4ab22a0d98ea9d658e09b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_061300184495c2919e63af50fa5df5d7 |
| publicationDate |
2017-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2017043829-A |
| titleOfInvention |
Method for producing dielectric substrate with metal-containing film |
| abstract |
An object of the present invention is to form a metal film having high adhesion on the surface of a dielectric substrate containing a fluororesin in a simpler manner and at a lower cost than conventional ones. Following a peroxide radical forming step of performing atmospheric pressure plasma treatment on the surface of a dielectric substrate containing a fluororesin, a copper β-ketocarboxylate compound and a boiling point are formed on the surface of the dielectric substrate. It is a copper containing composition containing the amine compound of 250 degrees C or less, Comprising: The copper containing composition which contains 1-40 mass parts of said (beta) -ketocarboxylic acid copper compounds with respect to a total of 100 mass parts of all the components of the said copper containing composition. A method for producing a dielectric substrate with a metal-containing film, comprising performing a copper-containing film forming step of applying an object and heating. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019189316-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019189316-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11773225-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115698151-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022024882-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113412171-A |
| priorityDate |
2015-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |