| abstract |
The present invention provides a sealing resin composition in which the adhesion between a lead frame of a semiconductor device and a copper or silver wire is improved, and the high temperature storage property and moisture resistance reliability of the semiconductor device are improved. A thermosetting resin component containing an epoxy resin, a curing accelerator, an inorganic filler, an ion trapping agent, and an electron-withdrawing functional group composed of at least one of a nitro group and a cyano group. An aromatic monocarboxylic acid, is solid at 25 ° C., has a sulfur content measured by fluorescent X-ray analysis of 0.1% by mass or less in terms of SO 3 , and has a pH value of 5.0 to A sealing resin composition in a range of 7.5. [Selection figure] None |