| abstract |
PROBLEM TO BE SOLVED: To develop a dicing / die bonding integrated tape having high adhesiveness in a dicing process and having low peelability (low adhesiveness) in a pickup process, in particular, low adhesiveness in a pickup process. Disclosed is a dicing / die bonding integrated tape having an adhesive layer. SOLUTION: In a dicing / die bonding integrated tape that has a structure in which at least a base layer, an adhesive layer, and an adhesive layer are sequentially laminated, and picks up by ultraviolet irradiation, dicing that is irradiated with ultraviolet rays that includes a base layer and an adhesive layer. As a parameter X for evaluating the peelability between the adhesive layer and the adhesive layer of the tape, it is an elastic modulus among relaxation factors corresponding to the time required for the pickup process obtained by fitting stress relaxation measurement data with a seven-element Maxwell model. A dicing / die bonding integrated tape in which the parameter X is 40 [MPa] or more and the surface free energy of the adhesive layer before ultraviolet irradiation is 9 mJ / m 2 or more. [Selection] Figure 1 |