| abstract |
An epoxy resin composition that can be electrolessly plated in a simple process and a thin and lightweight semiconductor device having an electromagnetic wave shielding layer formed by electroless plating using the composition. (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a curing agent, (C) an inorganic filler, (D) a Pd (II) compound, and (E) The resin composition for semiconductor sealing containing the silane coupling agent represented by Formula (1). (In the formula (1), R1 and R2 represent an alkyl group having 1 to 3 carbon atoms, R3 represents a hydrogen atom, -C2H4NH2 or a phenyl group. L and m are integers of 0 to 3. And l + m = 3, where n is an integer from 1 to 3.) [Selection] None |