| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2311-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 |
| filingDate |
2016-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71cdd502054f7fec41c16839a6f0f723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7340436d9dc180cedca6ded903483c2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e7fb1e27c4cc11ba120136b89b5ad96 |
| publicationDate |
2017-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2017008411-A |
| titleOfInvention |
Copper foil with carrier, laminate, laminate production method, printed wiring board production method, and electronic device production method |
| abstract |
PROBLEM TO BE SOLVED: To provide a copper foil with a carrier capable of satisfactorily suppressing the generation of pinholes generated when the carrier is peeled off with respect to the copper foil with a carrier having an ultrathin copper layer having a thickness of 0.9 μm or less. A copper foil with a carrier having a carrier, an intermediate layer, and an ultrathin copper layer in this order, wherein the thickness of the ultrathin copper layer is 0.9 μm or less, and the surface of the carrier on the ultrathin copper layer side is JIS B0601. -When measured with a laser microscope in accordance with 1994, the arithmetic average roughness Ra is 0.3 μm or less, and the peel strength when the carrier is peeled off by the 90 ° peeling method according to JIS C 6471 8.1 Copper foil with carrier that is 20 N / m or less. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016135917-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102519446-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022501521-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11362337-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210049154-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7116848-B2 |
| priorityDate |
2015-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |