| abstract |
A thermally conductive silicone putty composition comprising the following components (A) to (D). (A) Formula (1) R1aSiO (4-a) / 2 (1) [R1 is one or two selected from the group of saturated or unsaturated monovalent hydrocarbon groups having 1 to 18 carbon atoms. The above group, a is an organopolysiloxane having a kinematic viscosity of 10 to 100,000 mm 2 / s at 25 ° C. represented by 1.8 ≦ a ≦ 2.2], and (B) an xylene-soluble organopolysiloxane, Organopolysiloxane raw rubber having an absolute viscosity at 25 ° C. of 5,000 to 40,000 mPa · s when dissolved in 30% by mass in xylene, (C) aluminum hydroxide powder having an average particle diameter of 0.5 to 10 μm, (D) One or more inorganic compound powders selected from aluminum powder, zinc oxide powder, alumina powder, boron nitride powder, and aluminum nitride powder having an average particle size of 0.5 to 100 μm. [Effect] The composition of the present invention has a fluidity, but a significant improvement in misalignment resistance is recognized. [Selection figure] None |