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filingDate 2014-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2016-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016526797-A
titleOfInvention LED with stress relaxation layer under metallization layer
abstract A semiconductor LED layer is epitaxially grown on the patterned surface of the sapphire substrate 10. The patterned surface enhances light extraction. The LED layer includes a p-type layer and an n-type layer. The LED layer is etched to expose the n-type layer. One or more first metal layers are patterned to form a p metal contact 32 and an n metal contact 33 in electrical contact with the p-type layer and the n-type layer. A dielectric polymer stress relaxation layer 36 is spin coated on the first metal layer to form a substantially planar surface on the first metal layer. The stress relaxation layer has an opening exposing the p metal contact and the n metal contact. Metal solder pads 44, 45 are formed on the stress relaxation layer and are in electrical contact with the p metal contact and the n metal contact through an opening in the stress relaxation layer. The stress relaxation layer acts as a buffer that accepts the difference in CTE between the solder pad and the underlying layer.
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