| abstract |
An apparatus generally relating to an interposer (600, 700, 800) is disclosed. In such a device, the interposer (600, 700, 800) includes a plurality of conductors (208, 451-459, 603-606) and a plurality of charge attracting structures (610, 620, 710, 720, 810, 820). Have. A plurality of charge attraction structures (610, 620, 710, 720, 810, 820) are coupled to the interposer (600, 700, 800) to provide at least one integrated circuit die (200). 202). The plurality of conductors (208, 451-459, 603-606) include a plurality of through-substrate vias (208). |