http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016219732-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
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filingDate 2015-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_815dd8267dcf543a7dedae49ed2bc78d
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publicationDate 2016-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016219732-A
titleOfInvention Thermally conductive composite silicone rubber sheet
abstract A thermally conductive silicone rubber layer having a thickness of 0.5 to 10 mm, containing a thermally conductive filler, having an Asker C hardness of 2 to 25, and having a slight surface adhesion, and a silicone resin. A heat conductive composite silicone rubber sheet obtained by laminating a graphite sheet layer having a thickness of 0.1 to 1.0 mm, which is impregnated or impregnated / cured, and has a slight surface adhesion. [Effects] The heat conductive composite silicone rubber sheet of the present invention has a low hardness and slightly adhesive heat conductive silicone rubber layer to achieve high adhesion, low heat resistance, and mounting on a substrate, for example. Low hardness silicone because it is excellent in thermal conductivity and is laminated with a graphite sheet layer in order to adapt to the stepped structure such as when applied with a single heat dissipation sheet to multiple semiconductor chips with different thickness Rubber deformation is eased and good workability is achieved. [Selection figure] None
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type http://data.epo.org/linked-data/def/patent/Publication

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