| abstract |
Provided are a resin composition for forming an insulating layer having a high glass transition point and excellent circuit embedding property, an adhesive film, a prepreg, a printed wiring board, and a semiconductor device using the same. A resin composition comprising (A) an epoxy resin, (B) a maleimide-containing silyl protected phenol, (C) an inorganic filler, and (D) a thermoplastic resin. [Selection figure] None |