| abstract |
A main object of the present invention is to provide a method for producing a resin-encapsulated part capable of producing a substrate-less resin-encapsulated part in which the part is encapsulated with a resin by a simple method. To do. The present invention provides a preparatory step of preparing an adhesive substrate having a substrate and an adhesive layer formed on the substrate, and a desired position on the adhesive layer of the adhesive substrate. A component placement step of placing the component, a sealing step of sealing the component with a resin using a mold to form a resin-sealed component on the adhesive substrate, and the resin-sealed component to the above It has as its main object to provide a method for producing a resin-encapsulated part, comprising a peeling step for peeling off an adhesive substrate. [Selection] Figure 1 |