http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016207804-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate | 2015-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1da0d69a837b9db99c23f9b6c31410ee http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82682e8dc91f40fe371c6bd98bb6a40f |
| publicationDate | 2016-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016207804-A |
| titleOfInvention | Thermal conductive paste and electrical / electronic components |
| abstract | [PROBLEMS] To provide a heat conductive paste capable of obtaining a cured product that achieves both of the conflicting characteristics of improved thermal conductivity and improved connection reliability, has good heat dissipation, and high connection reliability. Provide electrical and electronic components. A resin component and high thermal conductivity and low heat dispersed in the resin component and having a thermal conductivity of 100 W / (m · K) or more and a thermal expansion coefficient of 10 × 10 −6 / ° C. or less. And a filler made of an expanded metal. [Selection figure] None |
| priorityDate | 2015-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.