| abstract |
Photosensitivity capable of alkali development, excellent in photosensitivity, capable of suppressing development residue even when a film is formed using a roll-type thermal vacuum laminator, and having excellent wiring coverage even when the film is thinned. A photosensitive resin composition, a photosensitive film laminate, a flexible printed wiring board, and a method for producing the same are provided. A photosensitive resin composition includes (A) a polyimide precursor, (B) a polymerizable compound having an unsaturated double bond, (C) a photopolymerization initiator, and (D) an antioxidant. The (D) antioxidant contains a structure represented by the following general formula (1). [Selection figure] None |