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filingDate 2015-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45c396d32042455b388b3dc2c83202e0
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publicationDate 2016-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016204605-A
titleOfInvention Resin composition, resin sheet, cured resin and resin substrate
abstract The present invention provides a resin composition capable of obtaining excellent thermal characteristics. A resin composition includes an epoxy compound and a triphenylbenzene compound. This triphenylbenzene compound is a compound containing 1,3,5-triphenylbenzene as a skeleton and having a reactive group introduced into the skeleton. The content of 1,3,5-triphenylbenzene in the total organic matter is 5% by mass or more and less than 15% by mass.
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