| abstract |
Disclosed is a resin composition that has a chemical resistance even when cured at a low temperature of 270 ° C. or lower, and further provides a cured film having a high Tg and high adhesion to a substrate. (A) A polyimide precursor having a structural unit represented by the following formula (1) in an amount of 50 mol% or more based on all structural units, (b) a photopolymerizable compound having an acryloyl group, and (c) an actinic ray. And (d) a resin composition containing a solvent. [Selection figure] None |