| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate |
2016-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba226f4e5a5fd9e302c18a8119943163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ec2803beaa40412e6d5ee1caf8cfe34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83e119bcb3d4e1be957c6f7438bc1bb4 |
| publicationDate |
2016-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016194059-A |
| titleOfInvention |
Epoxy group-containing resin composition and molded article thereof |
| abstract |
The present invention provides a thermosetting resin composition that can be suitably used as a sealing material for semiconductor devices and has high reliability without warping or cracking, especially for power device applications. By using an acyclic carboxylic acid anhydride that has not been used in an epoxy curing system, the storage elastic modulus when the resin composition is cured is lowered, and cracks are less likely to occur during curing or during actual operation. A resin composition is obtained. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7298466-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021091814-A |
| priorityDate |
2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |