http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016191031-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f95046653068de921ad30a6f44677b72 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate | 2015-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cddf061fc898d38035115951ac70a45 |
| publicationDate | 2016-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016191031-A |
| titleOfInvention | One-component epoxy resin composition for semiconductor encapsulation, cured product, method for producing semiconductor component, and semiconductor component |
| abstract | Disclosed is a novel one-pack epoxy resin composition for semiconductor encapsulation, which provides a cured product having excellent liquid stability and excellent heat resistance and low thermal expansion. As a one-component epoxy resin composition for semiconductor encapsulation, (A) (a1) an alicyclic diepoxy resin as a main agent and (a2) a polyepoxy resin having at least three alicyclic epoxy groups; (B) Alicyclic acid anhydride as a curing agent, (C) Amine adduct particles as a curing accelerator, (D) Silica particles as a filler, and (E) Alkali as a one-component stabilizer. A composition containing an inorganic filler is used. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11702520-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021503033-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111406095-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111406095-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019139354-A1 |
| priorityDate | 2015-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.