abstract |
An epoxy resin composition that provides a cured product having high Tg, thermal decomposition stability, and thermal conductivity is provided. A polyhydroxy resin represented by the formula (3), which is a reaction product of a biphenol represented by the formula (1) and an aromatic crosslinking agent represented by the formula (2), is reacted with epichlorohydrin. Obtained epoxy resin and composition thereof. (N is an integer from 0 to 20) [Selection figure] None |