http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016187830-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_905122d8678a831c0f8af203f34145dc |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 |
| filingDate | 2015-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e6b0a26a41894f483dead5130b3eb8e |
| publicationDate | 2016-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016187830-A |
| titleOfInvention | Laser processing equipment |
| abstract | The present invention relates to a laser processing apparatus for processing a workpiece by irradiating a laser beam, and provides a laser processing apparatus capable of reducing a decrease in processing quality even when processing by the laser light is interrupted. In a laser processing system, a laser processing apparatus has a laser oscillation unit and a galvano scanner, and is connected to a laser controller, a power supply unit, and a PC. In the process of performing the marking process according to the drawing data, a processing interruption instruction using the input operation unit 76 of the PC 7 is accepted (S3: YES), and the completion time specified based on the drawing data is a predetermined time or more. In the case (S4: YES), the drawing interruption position PI corresponding to the machining interruption instruction is determined based on the drawing data (S4 to S5), and the marking process is interrupted when the marking process up to the drawing interruption position PI is completed. (S6). [Selection] Figure 4 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7250231-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018164932-A |
| priorityDate | 2015-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.