| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81192 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4673
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
| filingDate |
2015-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7cc1048f6c2ad9ec0be2ecca9d3c885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c20adfe203ce80dd8d24aa94f2fa593b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4308752e855a46f4a236d7230610c13 |
| publicationDate |
2016-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016184647-A |
| titleOfInvention |
Organic resin substrate manufacturing method, organic resin substrate, and semiconductor device |
| abstract |
A method for manufacturing an organic resin substrate excellent in electrical connectivity and usable for manufacturing a miniaturized semiconductor device with high yield, an organic resin substrate obtained by the method, and the organic resin substrate A semiconductor device is provided. A step of forming a first metal pattern on a base substrate, a step of forming a first organic resin film to bury the first metal pattern, and an entire surface of the first organic resin film. And the step of exposing the upper surface of the first metal pattern 50 and the step of forming the conductor 230 so as to contact the exposed metal wiring in the first metal pattern 50 in this order. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019204974-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7095912-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021510586-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019140161-A |
| priorityDate |
2015-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |